Sensor package fabrication via additive manufacturing for automotive sector

sensor package

Sensor package fabrication via additive manufacturing for automotive sector – An introduction to the TINKER project by Leo Schranzhofer, Project Manager / Research Scientist, Profactor GmbH, at ONLINE 3D Printing Electronics Conference (21 January 2021, 15:00 – 19:00 CET). REGISTER HERE to attend the conference

Continue reading “Sensor package fabrication via additive manufacturing for automotive sector”