Sensor package fabrication via additive manufacturing for automotive sector

Sensor package fabrication via additive manufacturing for automotive sector – An introduction to the TINKER project by Leo Schranzhofer, Project Manager / Research Scientist, Profactor GmbH, at ONLINE 3D Printing Electronics Conference (21 January 2021, 15:00 – 19:00 CET). REGISTER HERE to attend the conference

This H2020 project, coordinated by Leo Schranzhofer, PROFACTOR, started at 01.10.2020. Notion Systems and PV nanocell are partners in the consortium and will be mentioned in the talk.

The vision of TINKER is to provide a new cost- and resource efficient pathway for RADAR and LIDAR sensor package fabrication with high throughput up to 250units/min, improved automation by 20%, improved accuracy by 50% and reliability by a factor of 100 to the European automotive and microelectronic industry via additive manufacturing and inline feedback control mechanisms. Read more

The 3D Printing Electronics Conference is a platform and information interface enabling an exchange of informations on market requirements, research interests and current results, skills and resources as well as facilitating the building of future partnerships. Academics, engineers, designers, and managers are invited to lecture on their state-of-the-art developments and future prospects or display their products and offers as exhibitor.

Focus topics of the conference:

  • Various aspects involving (3D) printed electronics, such as:
    • combining functional elements such as electronics (sensors or switches) into a (3D) printed product hybrid / printed circuit boards
    • processes that integrate electronics onto or within 3D printed parts
    • 3D Printed Optics / Photonics
  • Challenges for manufacturers / engineers / researchers
  • Future prospects / applications

Who attends?

  • Decision makers in the industrial electronics supply chain, such as CTO’s and COO’s of OEMs, managers of (high tech) suppliers and subcontractors
  • PCB manufacturers (Engineering, Design, Production etc.)
  • Semicon Industry
  • Procurement management
  • Investors
  • Design & engineering experts
  • Professionals involved in developing electronic products, such as product designers, engineers, product managers, (consumer) electronics manufacturers, software developers and ‘internet of things’ system integrators
  • Anyone curious about new technologies and developments in the (3D)printing electronics/optics/photonics industry.

This conference organized by Jakajima, is one in series of 3D Printing Conferences.

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